DocumentCode
2172298
Title
Evolution of Cu Electro-Deposition Technologies for 45nm and Beyond
Author
Shue, Winston S.
Author_Institution
TMSC, Hsin-Chu
fYear
2006
fDate
5-7 June 2006
Firstpage
175
Lastpage
177
Abstract
As device geometry continues to diminish, the requirement of reliable copper metallization of narrow geometries becomes very challenging. The physical, electrical, reliability and manufacturability aspects of Cu electro-deposition (ECD) require full characterization for future generations. This paper will address the key challenges of ECD modules and several some possible solutions through proper optimizations of ECD process. The extendibility of ECD beyond 45 nm-node technologies was discussed
Keywords
copper; electrodeposition; integrated circuit metallisation; 45 nm; Cu; ECD modules; copper metallization; electrical aspects; electrodeposition technology; manufacturability aspects; narrow geometries; optimization; physical aspects; reliability aspects; Atherosclerosis; Character generation; Chemicals; Copper; Filling; Geometry; Manufacturing processes; Metallization; Nanoscale devices; Tides;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference, 2006 International
Conference_Location
Burlingame, CA
Print_ISBN
1-4244-0104-6
Type
conf
DOI
10.1109/IITC.2006.1648680
Filename
1648680
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