Breakthrough Integration of 32nm-node CulCntra Low-k SiOC (k=2.0) Interconnects by using Advanced Pore-Sealing and Low-k Hard Mask Technologies

Author

Arakawa, S. ; Mizuno, I. ; Ohoka, Y. ; Nagahata, K. ; Tabuchi, K. ; Kanamura, R. ; Kadomura, S.

Author_Institution

Semicond. Technol. Dev. Group, Sony Corp., Kanagawa

fYear

2006

fDate

5-7 June 2006

Firstpage

210

Lastpage

212

Abstract

The breakthrough integration of Cu/ultra low-k (ULK) SiOC (k = 2.0) interconnects by using advanced pore-sealing and low-k hard mask (HM, k = 2.65) technologies has been accomplished. A low-k HM (k = 2.65) on a hybrid (PAr/SiOC) structure was successfully integrated by using a newly developed protection hard mask (PHM) process that provides a well-controlled dual-damascene (DD) profile. A significant reduction in innerline capacitance was achieved without degradation of TDDB performance and electrical properties. For via ILD, ULK SiOC (k = 2.0) was introduced and has achieved good electrical properties. In addition, an organic gas plasma treatment (OPT) was developed as a pore sealing process, which has resulted in significant improvement of stress migration (SM) and electromigration (EM) performances. Morever, this work revealed the mechanism of the reliability improvement. It was concluded that these advanced pore-sealing and low-k HM technologies are the most feasible integration scheme for 32nm-node Cu/ULK interconnects

Keywords

copper alloys; electric breakdown; electromigration; integrated circuit interconnections; low-k dielectric thin films; reliability; silicon compounds; 32 nm; SiOC; TDDB performance; ULK interconnects; advanced pore-sealing; copper interconnects; electromigration; low-k hard mask; organic gas plasma treatment; protection hard mask; reliability improvement; stress migration; ultra low-k interconnects; well-controlled dual-damascene profile; Capacitance; Etching; Moisture; Plasma properties; Polymer films; Prognostics and health management; Protection; Samarium; Stress; Thermal degradation;

fLanguage

English

Publisher

ieee

Conference_Titel

Interconnect Technology Conference, 2006 International

Conference_Location

Burlingame, CA

Print_ISBN

1-4244-0104-6

Type

conf

DOI

10.1109/IITC.2006.1648690

Filename

1648690