Title :
HOT TOPIC - Concurrent SoC development and end-to-end planning
Author_Institution :
TIMA Laboratory, France
Abstract :
SoC development requires interaction between a wide range of engineering disciplines. Each of which brings in optimisation factors that impacts other disciplines. Therefore, concurrent development and end-to-end planning between these disciplines are necessary. This session will show the overlap between design, packaging, silicon manufacturing, test and yield optimisation.
Keywords :
Design optimization; Laboratories; Manufacturing; Packaging; Silicon; Testing;
Conference_Titel :
Design, Automation & Test in Europe Conference & Exhibition, 2009. DATE '09.
Conference_Location :
Nice
Print_ISBN :
978-1-4244-3781-8
DOI :
10.1109/DATE.2009.5090702