DocumentCode
2173243
Title
Thermal cyclic fatigue of the interconnect of a flex-type BGA
Author
Hung, S.C. ; Zheng, P.J. ; Lee, S.C. ; Ho, S.H. ; Chen, H.N.
Author_Institution
Adv. Semicond. Eng. Inc., Kaohsiung, Taiwan
fYear
2000
fDate
2000
Firstpage
1384
Lastpage
1391
Abstract
Assurance of board level reliability is necessary and required for adopting any new packages into products. Therefore, there is a great interest to study solder joint reliability of a ball grid array package using flex-type substrate, which is developed and named “Film BGA” in ASE. This paper presents board level reliability test results of this flex-type package under thermal cyclic test
Keywords
ball grid arrays; fatigue; reliability; soldering; Film BGA; ball grid array package; board-level reliability; flex-type substrate; interconnect; intermetallic compound formation; solder joint fatigue; thermal cycling; Fatigue; Gold; Life testing; Packaging; Polyimides; Soldering; Substrates; Surface finishing; System testing; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-5908-9
Type
conf
DOI
10.1109/ECTC.2000.853390
Filename
853390
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