Title :
Thermal cyclic fatigue of the interconnect of a flex-type BGA
Author :
Hung, S.C. ; Zheng, P.J. ; Lee, S.C. ; Ho, S.H. ; Chen, H.N.
Author_Institution :
Adv. Semicond. Eng. Inc., Kaohsiung, Taiwan
Abstract :
Assurance of board level reliability is necessary and required for adopting any new packages into products. Therefore, there is a great interest to study solder joint reliability of a ball grid array package using flex-type substrate, which is developed and named “Film BGA” in ASE. This paper presents board level reliability test results of this flex-type package under thermal cyclic test
Keywords :
ball grid arrays; fatigue; reliability; soldering; Film BGA; ball grid array package; board-level reliability; flex-type substrate; interconnect; intermetallic compound formation; solder joint fatigue; thermal cycling; Fatigue; Gold; Life testing; Packaging; Polyimides; Soldering; Substrates; Surface finishing; System testing; Vehicles;
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
DOI :
10.1109/ECTC.2000.853390
