Title :
Verification of RF and mixed-signal integrated circuits for substrate coupling effects
Author :
Verghese, Nishath K. ; Allstot, David J.
Author_Institution :
Cadence Design Syst. Inc., San Jose, CA, USA
Abstract :
This paper introduces the substrate coupling problem in RF and mixed-signal integrated circuits and discusses methods for its verification. Special emphasis is placed on modeling techniques for the substrate. A methodology is presented that utilizes macromodels of the circuit, substrate and package for efficient simulation of substrate coupling. A design example illustrates an application of such a methodology
Keywords :
MMIC; UHF integrated circuits; integrated circuit design; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; mixed analogue-digital integrated circuits; IC packaging; RF integrated circuits; design example; macromodels; mixed-signal integrated circuits; modeling techniques; substrate coupling effects; Coupling circuits; Crosstalk; Failure analysis; Feedback circuits; Guidelines; Impact ionization; Mixed analog digital integrated circuits; Monolithic integrated circuits; Radio frequency; Substrates;
Conference_Titel :
Custom Integrated Circuits Conference, 1997., Proceedings of the IEEE 1997
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-3669-0
DOI :
10.1109/CICC.1997.606648
