• DocumentCode
    2173320
  • Title

    The status of lead-free solder alloys

  • Author

    Seelig, Karl ; Suraski, David

  • Author_Institution
    AIM Inc., Cranston, RI, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    1405
  • Lastpage
    1409
  • Abstract
    The issue of lead-free soldering has piqued a great deal of interest in the electronics assembly industry as of late. What once was an issue that seemed too far away to worry about has become a pressing reality. In order to avoid confusion, last minute panic, and a misunderstanding of how the issue of lead-free soldering will affect the industry and individuals users of solders, it is necessary for all suppliers and assemblers to become educated in this matter. This paper shall provide a discussion of the direction that the industry is moving (and why), the most viable solutions for board assemblers, and an analysis of the most pertinent and comprehensive alloy comparative test data available
  • Keywords
    Environmental factors; Soldering; electronic assembly; lead-free solder alloy; Assembly; Consumer electronics; Costs; Environmentally friendly manufacturing techniques; Europe; Immune system; Industrial electronics; Lead; Legislation; Soldering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    0-7803-5908-9
  • Type

    conf

  • DOI
    10.1109/ECTC.2000.853393
  • Filename
    853393