DocumentCode
2173320
Title
The status of lead-free solder alloys
Author
Seelig, Karl ; Suraski, David
Author_Institution
AIM Inc., Cranston, RI, USA
fYear
2000
fDate
2000
Firstpage
1405
Lastpage
1409
Abstract
The issue of lead-free soldering has piqued a great deal of interest in the electronics assembly industry as of late. What once was an issue that seemed too far away to worry about has become a pressing reality. In order to avoid confusion, last minute panic, and a misunderstanding of how the issue of lead-free soldering will affect the industry and individuals users of solders, it is necessary for all suppliers and assemblers to become educated in this matter. This paper shall provide a discussion of the direction that the industry is moving (and why), the most viable solutions for board assemblers, and an analysis of the most pertinent and comprehensive alloy comparative test data available
Keywords
Environmental factors; Soldering; electronic assembly; lead-free solder alloy; Assembly; Consumer electronics; Costs; Environmentally friendly manufacturing techniques; Europe; Immune system; Industrial electronics; Lead; Legislation; Soldering;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-5908-9
Type
conf
DOI
10.1109/ECTC.2000.853393
Filename
853393
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