Title :
The status of lead-free solder alloys
Author :
Seelig, Karl ; Suraski, David
Author_Institution :
AIM Inc., Cranston, RI, USA
Abstract :
The issue of lead-free soldering has piqued a great deal of interest in the electronics assembly industry as of late. What once was an issue that seemed too far away to worry about has become a pressing reality. In order to avoid confusion, last minute panic, and a misunderstanding of how the issue of lead-free soldering will affect the industry and individuals users of solders, it is necessary for all suppliers and assemblers to become educated in this matter. This paper shall provide a discussion of the direction that the industry is moving (and why), the most viable solutions for board assemblers, and an analysis of the most pertinent and comprehensive alloy comparative test data available
Keywords :
Environmental factors; Soldering; electronic assembly; lead-free solder alloy; Assembly; Consumer electronics; Costs; Environmentally friendly manufacturing techniques; Europe; Immune system; Industrial electronics; Lead; Legislation; Soldering;
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
DOI :
10.1109/ECTC.2000.853393