Simulation and modeling of force convection in metal foam for electronics devices cooling system

It is estimated the power dissipation requirement in order of 30-50W/cm² is anticipated for the next 5 to 6 years with the pursuit of compact of for thermal system, efficient removal of high-powered heat from the system has emerged as a crucial task. The crux of these studies is how to enhance heat transport for given flow geometry and externally imposed physical constraints. To enhance convective thermal transport we have focused on the utilization of metal foam in thermal system. The motivation is attributed to enhance heat transfer due to the high surface area to volume ratio as well as flow mixing due to toutuosity of metal foam. The paper explores the use of open-cell porous metal foams use as a longitudinal finned of copper alloy with different sample grades (60 K, 100 K & 200 K) & approximately constant porosity i.e 60%. An analytical modal is developed by considering effective thermal conductivity & analysis is done by well-known FEM base software ´ANSYS - 10´ & compared with experimental results.