DocumentCode :
2173767
Title :
Synthesis and high temperature thermoelectric properties of n-type BayNixCo4-xSb12
Author :
Tang, X.E. ; Chen, L.D. ; Goto, T. ; Dyck, J.S. ; Chen, W. ; Uher, C. ; Hirai, T. ; Yuan, R.Z.
Author_Institution :
State Key Lab. of Adv. Technol. for Mater. Synthesis & Process., Wuhan Univ. of Technol., China
fYear :
2001
fDate :
2001
Firstpage :
97
Lastpage :
100
Abstract :
Single-phase filled skutterudite compounds BayNx Co4-xSb12 (x=0-0.1, y=0-0.4) were synthesized by a two-step solid state reaction. Effects of Ba filling fraction and Ni content on the thermoelectric properties of n-type Ba yNixCo4-xSb12 were investigated. Thermal conductivity decreased with increasing Ba filling fraction and temperature. When barium filling fraction (y) was fixed at 0.3, the thermal conductivity decreased with increasing Ni content, and reached a minimum value at about x=0.05. Electron concentration and electrical conductivity increased with increasing Ba filling fraction and Ni content. Seebeck coefficient increased with increasing temperature, and decreased with increasing Ba filling fraction and Ni content. A maximum ZT value of 1.2 was obtained at about 800 K for Ba 0.3Ni0.05Co3.95Sb12
Keywords :
Seebeck effect; barium compounds; cobalt compounds; electrical conductivity; electron density; materials preparation; nickel compounds; semiconductor materials; thermal conductivity; 800 K; Ba filling fraction; Ba0.3Ni0.05Co3.95Sb12; Ni content; Seebeck coefficient; electrical conductivity; electron concentration; filled skutterudite compounds; n-type samples; thermal conductivity; thermoelectric properties; two-step solid state reaction; Atmospheric measurements; Barium; Conducting materials; Filling; Lattices; Plasma measurements; Plasma temperature; Powders; Thermal conductivity; Thermoelectricity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2001. Proceedings ICT 2001. XX International Conference on
Conference_Location :
Beijing
ISSN :
1094-2734
Print_ISBN :
0-7803-7205-0
Type :
conf
DOI :
10.1109/ICT.2001.979831
Filename :
979831
Link To Document :
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