DocumentCode :
2173908
Title :
The influence of process parameters on the carrier generation during the hot pressing of Bi2Te3-Bi2Se 3 solid solutions
Author :
Ha, Heon Phil ; Kim, Tae Hoon ; Bin Hyun, Dow
Author_Institution :
Metals Process. Center, Korea Inst. of Sci. & Technol., Seoul, South Korea
fYear :
2001
fDate :
2001
Firstpage :
117
Lastpage :
120
Abstract :
Hot pressed Bi2Te3-Bi2Se3 alloys show different thermoelectric properties compared to alloys grown by the ordinary zone melting growth method. When specimens were hot pressed, thermoelectric properties changed according to different particle size, pressing time and hot pressing temperature. The effects of these individual parameters on the thermoelectric properties of hot pressed materials were examined. Special emphasis was put on carrier generation mechanisms related to the following parameters; oxidation, mechanical deformation during pulverization and the hot pressing temperature. It was found that all processing parameters influence the generation of electrically active defects. Defects induced by the mechanical deformation and oxygen cause generation of donors. Defect concentration is also altered with different hot pressing temperatures depending on the amount of previously received mechanical deformation. A figure of merit of 2.4×10-3 K-1 could be obtained at an optimal process condition
Keywords :
bismuth compounds; carrier density; crystal defects; defect states; deformation; hot pressing; oxidation; particle size; semiconductor growth; semiconductor materials; solid solutions; thermoelectricity; zone melting; Bi2Te3-Bi2Se3; carrier generation; defect concentration; donors; electrically active defects; figure of merit; hot pressing; mechanical deformation; oxidation; particle size; pressing temperature; pressing time; process parameters; pulverization; solid solutions; thermoelectric properties; zone melting growth; Bismuth; Mechanical factors; Oxidation; Powders; Pressing; Solids; Tellurium; Temperature; Thermal conductivity; Thermoelectricity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2001. Proceedings ICT 2001. XX International Conference on
Conference_Location :
Beijing
ISSN :
1094-2734
Print_ISBN :
0-7803-7205-0
Type :
conf
DOI :
10.1109/ICT.2001.979836
Filename :
979836
Link To Document :
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