• DocumentCode
    2174086
  • Title

    InGaAs/InAlAs quantum wells on wafer bonded InP/GaAs substrates

  • Author

    Hayashi, S. ; Sandhu, R. ; Chen, G. ; Hicks, R. ; Goorsky, M.S.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., California Univ., Los Angeles, CA, USA
  • fYear
    2005
  • fDate
    8-12 May 2005
  • Firstpage
    389
  • Lastpage
    391
  • Abstract
    Metalorganic vapor phase epitaxial growth of InGaAs/InAlAs quantum well structures on wafer bonded and exfoliated InP films on GaAs substrates were assessed. The composite substrates were fabricated using silicon nitride intermediate layers and through hydrogen-implant induced exfoliation of an InP layer. The InP layer was subjected to a chemical mechanical polish step to produce an epi-ready sub-nm surface roughness prior to the epitaxial growth. Photoluminescence, x-ray rocking curve, and transmission electron microscopy results from the heterostructures grown on the InP/GaAs template wafers were comparable to measurements from structures grown on standard InP substrates, demonstrating that this type of composite substrate can withstand high temperature epitaxial growth processes.
  • Keywords
    III-V semiconductors; MOCVD; aluminium compounds; chemical mechanical polishing; gallium arsenide; indium compounds; photoluminescence; semiconductor quantum wells; surface roughness; transmission electron microscopy; vapour phase epitaxial growth; InGaAs-InAlAs; InGaAs-InAlAs quantum well; InP-GaAs; X-ray rocking curve; chemical mechanical polish; heterostructure; hydrogen-implant induced exfoliation; metalorganic vapor phase epitaxial growth; photoluminescence; silicon nitride intermediate layer; surface roughness; transmission electron microscopy; wafer bonded InP-GaAs composite substrate; Chemicals; Epitaxial growth; Gallium arsenide; Indium compounds; Indium gallium arsenide; Indium phosphide; Rough surfaces; Silicon; Substrates; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials, 2005. International Conference on
  • ISSN
    1092-8669
  • Print_ISBN
    0-7803-8891-7
  • Type

    conf

  • DOI
    10.1109/ICIPRM.2005.1517509
  • Filename
    1517509