• DocumentCode
    2174122
  • Title

    Thermal stability of thermoelectric properties for nondoped PbTe

  • Author

    Tanaka, Kentaro ; Kohri, Hitoshi ; Shiota, Ichiro ; Nishida, Isao A.

  • Author_Institution
    Graduate Sch., Kogakuin Univ., Tokyo, Japan
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    154
  • Lastpage
    156
  • Abstract
    The undoped PbTe compounds were prepared by the vertical Bridgman method. Hall coefficient RH and ρ were measured by a d.c. four-terminal method. The temperature dependence of ρ and RH were measured in the temperature range from 700 to 300K in an Ar atmosphere. PbTe showed p-type conduction at 300K and was transformed to n-type conduction at about 500K. No thermal hysteresis was observed in the temperature dependence of ρ for the heating temperature below 500K at slower cooling rates than 8.88×10-2K/s and at cooling rates above 6.45×10-1 K/s from 700K. The thermal hysteresis in the temperature dependence of ρ was confirmed at a slower cooling rate than 8.88×10-2K/s at temperatures higher than 600K. The Hall concentration of a specimen which showed thermal hysteresis in the ρ-curve at the slow cooling rate of 8.88×10-2K/s from 700K was found to be 1.25×1024/m3 smaller, 1/3 of that with no thermal hysteresis
  • Keywords
    Hall effect; IV-VI semiconductors; crystal growth from melt; lead compounds; thermal stability; thermoelectricity; 700 to 300 K; Ar atmosphere; Hall coefficient; PbTe; cooling rate; n-type conduction; p-type conduction; temperature dependence; thermal hysteresis; thermoelectric properties; vertical Bridgman method; Argon; Atmosphere; Atmospheric measurements; Cooling; Hysteresis; Temperature dependence; Temperature distribution; Temperature measurement; Thermal stability; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2001. Proceedings ICT 2001. XX International Conference on
  • Conference_Location
    Beijing
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-7205-0
  • Type

    conf

  • DOI
    10.1109/ICT.2001.979845
  • Filename
    979845