• DocumentCode
    2174125
  • Title

    Qualification and reliability tests: What are we doing and why?

  • Author

    Munroe, R.A.

  • Author_Institution
    Motorola Inc., Austin, TX, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    1576
  • Lastpage
    1581
  • Abstract
    The semiconductor industry and its customers perform component qualification tests and reliability tests that are reasonably similar if not the same due to the standards in the industry and tradition. Some of the tests are not reliability tests, but robustness tests and the term reliability is often misused. As semiconductor technology has advanced and electronic packaging has changed the tests and criteria have not been changed at the same rate. The spectrum of applications has grown so that in some cases the tests are overly stringent or testing for the wrong failure mechanisms. In other cases the tests do not adequately reflect the level or length of time necessary to ensure successful applications. This paper will attempt to challenge the conventional tests and acceptance of those tests and to encourage the reader to look at semiconductor tests in a different light. A proposed method is made to use the tests in place in a more productive manner
  • Keywords
    packaging; semiconductor device reliability; semiconductor device testing; electronic packaging; qualification testing; reliability testing; semiconductor component; Assembly; Circuit testing; Life testing; Packaging; Performance evaluation; Qualifications; Semiconductor device testing; Stress; Substrates; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    0-7803-5908-9
  • Type

    conf

  • DOI
    10.1109/ECTC.2000.853425
  • Filename
    853425