Snap array CSPTM. Ceramic CSPs for high performance and high reliability applications

Chip Scale Package (CSP) adaptation has been drastically increasing as the key component to facilitate miniaturization for portable electronic devices such as Cellular phone, Camcorder, PDA, etc. which are mainly consumer electronics devices. In addition, high I/O count CSP are predicted to support high performance IC devices for Workstation and Mainframe, and high reliability CSP is also demanded for broadening the application for high-end market such as satellite communication application. Ceramic has been a leading material for the rigid interposer style of CSP. Ceramic technology has many advantages such as design flexibility with fine design rule, buried and blind via holes, high thermal conductivity, and stability of material properties at high temperature and harsh environment. Ceramic technology is considered to be the most suitable for CSP application where high performance and high reliability are required. Kyocera has been developing Snap Array CSP^TM technologies utilizing ceramic technology and optimized assembly materials. Productivity at assembly process has been drastically improved by using an array format carrier. Specification of an array format carrier is optimized for utilizing current assembly equipment designed for PBGA and PQFP. Through continued development and optimization, a wide variety of Snap Array CSP^TM have been realized