DocumentCode
2174245
Title
Applications of newly developed positive photosensitive block co-polyimides to CSPs
Author
Matsumoto, Shunichi ; Jin, Xing Zhou ; Fukushima, Takahumi ; Uemura, Takayuki ; Itatani, Hirosi
Author_Institution
PI R&D Co. Ltd., Yokohama, Japan
fYear
2000
fDate
2000
Firstpage
1610
Lastpage
1615
Abstract
Meeting the challenging market-defined needs of CSPs (chip sized packages) industry requires a new substrate technology that provides higher I/O densities, higher performance, thinner and lighter packaging structures than previously available solutions. In this paper, the first applications to CSP interposer (CSP-IP) processes by newly developed positive photosensitive block co-polyimides (PPI), which P I R&D Co., Ltd. of Japan has commercialized recently, are discussed
Keywords
chip scale packaging; photoresists; polymer blends; polymer films; substrates; PPI film; chip sized package; interposer process; positive photosensitive block co-polyimide; substrate technology; Chip scale packaging; Costs; Polyimides; Polymers; Postal services; Production; Research and development; Solvents; Temperature; Workability;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-5908-9
Type
conf
DOI
10.1109/ECTC.2000.853431
Filename
853431
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