Title :
Aging studies of PBGA solder joints reflowed at different conveyor speeds
Author :
Fan, S.H. ; Chan, Y.C. ; Tang, C.W. ; Lai, J.K.L.
Author_Institution :
Dept. of Electron. Eng., Hong Kong Univ., China
Abstract :
PBGA packages are more susceptible to solder joint fatigue problem due to the significant mismatches of the coefficient of thermal expansion (CTE) between bismaleimide triazine substrate (~15 ppm/°C) and silicon die (~2.5 ppm/°C). In this paper, the shear cycle fatigue properties of PBGA (Topline DC169) solder joints reflowed with different profiles, and aged at 125°C for 4, 9, 16, 25, and 36 days are studied. The profiles are devised to have the same “heating factor”, which is defined as the integral of the measured temperature above the liquidus (183°C) with respect to dwell time in the reflow profile, but to have different conveyor speeds. The effects of conveyor speed on the solder joint (non-aged and aged) fatigue lifetimes are investigated
Keywords :
ageing; ball grid arrays; fatigue; plastic packaging; reflow soldering; 125 C; PBGA package; Topline DC16; aging; bismaleimide triazine substrate; conveyor speed; reflow soldering; shear cycling; silicon die; solder joint fatigue lifetime; Aging; Cooling; Copper; Electronic packaging thermal management; Electronics packaging; Fatigue; Grain boundaries; Semiconductor device packaging; Soldering; Temperature measurement;
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
DOI :
10.1109/ECTC.2000.853440
