Taguchi design of experiment for wafer bumping by stencil printing

Author

Lau, John ; Chang, Chris

Author_Institution

Express Packaging Syst. Inc., Palo Alto, CA, USA

fYear

2000

fDate

2000

Firstpage

1705

Lastpage

1711

Abstract

Taguchi experiments are designed and carried out with five critical factors that influence the solder bumping of a 200 mm (8") wafer by stencil printing method. These factors are: paste types (type 3 and type 4), squeeze forces (9 and 12 lbs.), snap-off heights (0 and 5 mils), aperture shapes (square and circle), and aspect ratios (2.5 and 2.75). They are varied to form a two-level L8 orthogonal array experiment. Analysis of mean (ANOM) and analysis of variance (ANOVA) are used to choose the most influential factors. After fixing the most influential factors, a two-level L4 orthogonal array experiment is followed to optimize the other material and process parameters. Important results are summarized in this paper which could be very useful for wafer bumping with stencil printing method

Keywords

Taguchi methods; design of experiments; flip-chip devices; printing; soldering; 200 mm; ANOM; ANOVA; Taguchi design of experiments; flip-chip technology; solder bumping; stencil printing; two-level orthogonal array; wafer bumping; wafer-level packaging; Analysis of variance; Apertures; Copper; Flip chip; Heart; Packaging; Powders; Printing; Shape; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-5908-9

Type

conf

DOI

10.1109/ECTC.2000.853450

Filename

853450