Title :
Development of the environmentally friendly epoxy molding compound
Author :
Yagisawa, Takashi ; Suzuki, Hiroshi
Author_Institution :
Electron. Device Mater. Res. Lab., Sumitomo Bakelite Co. Ltd., Utsunomiya, Japan
Abstract :
Recently, awareness of environmental compatibility is increasing. Also in the semiconductor area, BrSb free molding compound and Pb free solder are being investigated for the increase of environmental compatibility. The elimination of BrSb from molding compound has been investigated for a long time. Currently some materials with metal hydrates or phosphorus flame retardants are in the market. In these materials, environmental pressure to remove halogens and antimony was considered. The aim of this investigation is to develop a novel molding compound that generates no defective products by 260°C reflow, and that is BrSb free
Keywords :
environmental factors; moulding; polymers; reflow soldering; 260 C; environmental compatibility; epoxy resin; flame retardant; molding compound; reflow soldering; Fires; Flame retardants; Land surface temperature; Lead; Packaging; Polymers; Resins; Semiconductor materials; Thermal resistance; Thermal stresses;
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
DOI :
10.1109/ECTC.2000.853454
