• DocumentCode
    2175239
  • Title

    Thermoelectric properties of electrically conductive polypyrrole film

  • Author

    Yan, Hu ; Ishida, Tomoko ; Toshima, Naoki

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Sci. Univ. of Tokyo, Yamaguchi, Japan
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    310
  • Lastpage
    313
  • Abstract
    We present thermoelectric properties of films of the electrically conductive organic polymer polypyrrole. Highly electrically conductive polypyrrole films were electrochemically prepared using sodium p-toluenesulfonate as a supporting electrolyte. Thermoelectric properties of the polypyrrole films were systematically investigated over a wide range of temperatures above room temperature. The high electrical conductivity of the polypyrrole films gives a significant advantage of high thermoelectric power factor. In addition polypyrrole films showed extremely low thermal diffusivity, similar to electrically conductive polyaniline films. The maximum ZT of the polypyrrole film, which was calculated using estimated thermal conductivity from the polyaniline films, is 10-2 at ca. 423 K. The value is comparable with that of the inorganic thermoelectric material FeSi2
  • Keywords
    conducting polymers; electrical conductivity; polymer films; synthetic metals; thermal conductivity; thermoelectric power; 423 K; FeSi2; electrical conductivity; electrically conductive polypyrrole film; electrochemical preparation; figure-of-merit; maximum ZT; organic polymers; polyaniline film; sodium p-toluenesulfonate; temperature effect; thermal diffusivity; thermoelectric power factor; thermoelectric properties; Conducting materials; Conductive films; Costs; Electronics cooling; Organic materials; Polymer films; Reactive power; Temperature distribution; Thermal conductivity; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2001. Proceedings ICT 2001. XX International Conference on
  • Conference_Location
    Beijing
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-7205-0
  • Type

    conf

  • DOI
    10.1109/ICT.2001.979894
  • Filename
    979894