Title :
Characterization of filled skutterudite LaFe3CoSb12 thin films prepared by laser ablation
Author_Institution :
Central Res. Lab., Japan Aviation Electron Ind. Ltd., Tokyo, Japan
Abstract :
We have prepared filled skutterudite LaFe3CoSb12 thin films using pulsed laser deposition. Stoichiometric, single-phase LaFe3CoSb12 films are obtained by selecting deposition parameters. The films are composed of small polycrystalline grains typically in the 20 to 100 nm range. Temperature dependencies of the Seebeck coefficient and other electronic transport properties at room temperature were measured for several single-phase LaFe3CoSb12 films synthesized at different deposition conditions. Although the Seebeck coefficient increases as the temperature increases from 100 to 400 K for all samples, its value varies depending on film synthesis conditions. The films also have high carrier concentrations (~ 1021 cm-3) and small mobility (< 10 cm2/Vs). These results imply that microscopic film qualities controlled by synthesis conditions affect their electronic properties
Keywords :
Seebeck effect; cobalt compounds; grain size; hole density; hole mobility; iron compounds; lanthanum compounds; pulsed laser deposition; semiconductor growth; semiconductor materials; semiconductor thin films; 100 to 400 K; 20 to 100 nm; LaFe3CoSb12; Seebeck coefficient; carrier concentration; deposition parameters; electronic transport properties; filled skutterudite LaFe3CoSb12 thin films; film synthesis condition effects; hole mobility; laser ablation; microscopic film quality; polycrystalline grains; pulsed laser deposition; stoichiometric single-phase LaFe3CoSb12 film; temperature dependence; Conducting materials; Laser ablation; Pulsed laser deposition; Semiconductor thin films; Sputtering; Temperature dependence; Temperature measurement; Thermal conductivity; Thermoelectricity; Transistors;
Conference_Titel :
Thermoelectrics, 2001. Proceedings ICT 2001. XX International Conference on
Conference_Location :
Beijing
Print_ISBN :
0-7803-7205-0
DOI :
10.1109/ICT.2001.979896