Plastic microwave multi-chip modules for wireless communication applications

Author

Krishnamurthy, V. ; Balch, E. ; Durocher, K. ; Rose, J. ; Saia, R. ; Lester, D. ; Sherwood, D.

Author_Institution

Gen. Electr. Corp. Res. & Dev. Center, Schenectady, NY, USA

fYear

1998

fDate

11-8 June 1998

Firstpage

127

Lastpage

130

Abstract

This paper describes a high density, microwave plastic multi-chip module (MCM) with vertical feed throughs providing RF/DC I/Os at the module backside allowing for a low thermal resistance solder attach to a printed circuit board. A return loss of better than -20 dB up to approximately 3.8 GHz was measured for the coplanar vertical interconnect from the plastic module to a printed circuit board. Functional T/R modules operating between 1.60 GHz and 2.0 GHz were also fabricated with this technology.

Keywords

microwave circuits; multichip modules; plastic packaging; thermal resistance; -20 dB; 1.6 to 2 GHz; T/R modules; coplanar vertical interconnect; high density MCMs; low thermal resistance solder attach; microwave multi-chip modules; plastic microwave MCM; vertical feed throughs; wireless communication applications; Electromagnetic heating; Feeds; Integrated circuit interconnections; MMICs; Microstrip; Plastics; Polyimides; Printed circuits; Thermal resistance; Wireless communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio Frequency Integrated Circuits (RFIC) Symposium, 1998 IEEE

Conference_Location

Baltimore, MD, USA

ISSN

1097-2633

Print_ISBN

0-7803-4439-1

Type

conf

DOI

10.1109/RFIC.1998.682063

Filename

682063