DocumentCode :
2175887
Title :
Foreword
fYear :
2008
fDate :
10-12 Dec. 2008
Abstract :
Presents the introductory welcome message from the conference proceedings.
Keywords :
Components, Packaging, and Manufacturing Technology Society; Electromagnetic interference; Electromagnetic measurements; Electromagnetic modeling; Electronics packaging; Microwave measurements; Power measurement; Power system modeling; RF signals; Semiconductor device measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-2633-1
Type :
conf
DOI :
10.1109/EDAPS.2008.4735979
Filename :
4735979
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2175887
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