DocumentCode
2175887
Title
Foreword
fYear
2008
fDate
10-12 Dec. 2008
Abstract
Presents the introductory welcome message from the conference proceedings.
Keywords
Components, Packaging, and Manufacturing Technology Society; Electromagnetic interference; Electromagnetic measurements; Electromagnetic modeling; Electronics packaging; Microwave measurements; Power measurement; Power system modeling; RF signals; Semiconductor device measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location
Seoul
Print_ISBN
978-1-4244-2633-1
Type
conf
DOI
10.1109/EDAPS.2008.4735979
Filename
4735979
Link To Document