DocumentCode :
2175931
Title :
Sponsors
fYear :
2008
fDate :
10-12 Dec. 2008
Abstract :
The conference organizers greatly appreciate the support of the various corporate sponsors listed.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-2633-1
Type :
conf
DOI :
10.1109/EDAPS.2008.4735981
Filename :
4735981
Link To Document :
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