Title :
QC-Fill: An X-Fill method for quick-and-cool scan test
Author :
Tzeng, Chao-Wen ; Huang, Shi-Yu
Author_Institution :
EE Dept., Nat. Tsing-Hua Univ.
Abstract :
In this paper, we present an X-Fill (QC-Fill) method for not only slashing the test time but also reducing the test power (including both capture power and shifting power). QC-Fill, built upon the existing multicasting scan architecture, can coexist with most low-capture-power (LCP) X-fill methods through a multicasting-driven X-Fill method incorporating a clique-stripping scheme. QC-Fill is independent of the ATPG patterns and does not require any area-overhead since it can directly operate on an existing scan architecture incorporating test compression.
Keywords :
automatic test pattern generation; logic testing; low-power electronics; system-on-chip; ATPG pattern; clique-stripping scheme; low-capture-power X-fill method; multicasting scan architecture; multicasting-driven X-fill method; quick-and-cool scan test; system-on-chip; test compression; Automatic test pattern generation; Broadcasting; Chaos; Clocks; Continuous wavelet transforms; Energy consumption; Nonhomogeneous media; Reduced instruction set computing; Synthetic aperture sonar; Testing; Low-Power Scan; Low-capture-power X-fill; Multicasting; Scan Test; Test Compression;
Conference_Titel :
Design, Automation & Test in Europe Conference & Exhibition, 2009. DATE '09.
Conference_Location :
Nice
Print_ISBN :
978-1-4244-3781-8
DOI :
10.1109/DATE.2009.5090835
