• DocumentCode
    2176319
  • Title

    Study on surface processing technique for thermoelectric material slices

  • Author

    Wang, Li ; Yu, Xiufa

  • Author_Institution
    Tianjin Lantian High-Tech Power Sources Joint-Stock Co. Ltd., China
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    483
  • Lastpage
    486
  • Abstract
    The study of surface processing technique for thermoelectric material slices is useful for improving performance, solderability and reliability of the thermoelectric modules. In this paper, we indicate the advantages and necessity of the technique, introduce several experimental methods, provide test results and illustrate the conclusion. This technique is suitable for assembling thermoelectric modules with all kinds of solders and the process can be easily controlled
  • Keywords
    modules; semiconductor device reliability; semiconductor device testing; soldering; surface treatment; thermoelectric devices; reliability; solderability; surface processing; thermoelectric material slices; thermoelectric modules; Adhesive strength; Assembly; Chemicals; Joining materials; Materials reliability; Nickel alloys; Production; Temperature; Thermoelectricity; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2001. Proceedings ICT 2001. XX International Conference on
  • Conference_Location
    Beijing
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-7205-0
  • Type

    conf

  • DOI
    10.1109/ICT.2001.979936
  • Filename
    979936