DocumentCode :
2176319
Title :
Study on surface processing technique for thermoelectric material slices
Author :
Wang, Li ; Yu, Xiufa
Author_Institution :
Tianjin Lantian High-Tech Power Sources Joint-Stock Co. Ltd., China
fYear :
2001
fDate :
2001
Firstpage :
483
Lastpage :
486
Abstract :
The study of surface processing technique for thermoelectric material slices is useful for improving performance, solderability and reliability of the thermoelectric modules. In this paper, we indicate the advantages and necessity of the technique, introduce several experimental methods, provide test results and illustrate the conclusion. This technique is suitable for assembling thermoelectric modules with all kinds of solders and the process can be easily controlled
Keywords :
modules; semiconductor device reliability; semiconductor device testing; soldering; surface treatment; thermoelectric devices; reliability; solderability; surface processing; thermoelectric material slices; thermoelectric modules; Adhesive strength; Assembly; Chemicals; Joining materials; Materials reliability; Nickel alloys; Production; Temperature; Thermoelectricity; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2001. Proceedings ICT 2001. XX International Conference on
Conference_Location :
Beijing
ISSN :
1094-2734
Print_ISBN :
0-7803-7205-0
Type :
conf
DOI :
10.1109/ICT.2001.979936
Filename :
979936
Link To Document :
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