DocumentCode
2176319
Title
Study on surface processing technique for thermoelectric material slices
Author
Wang, Li ; Yu, Xiufa
Author_Institution
Tianjin Lantian High-Tech Power Sources Joint-Stock Co. Ltd., China
fYear
2001
fDate
2001
Firstpage
483
Lastpage
486
Abstract
The study of surface processing technique for thermoelectric material slices is useful for improving performance, solderability and reliability of the thermoelectric modules. In this paper, we indicate the advantages and necessity of the technique, introduce several experimental methods, provide test results and illustrate the conclusion. This technique is suitable for assembling thermoelectric modules with all kinds of solders and the process can be easily controlled
Keywords
modules; semiconductor device reliability; semiconductor device testing; soldering; surface treatment; thermoelectric devices; reliability; solderability; surface processing; thermoelectric material slices; thermoelectric modules; Adhesive strength; Assembly; Chemicals; Joining materials; Materials reliability; Nickel alloys; Production; Temperature; Thermoelectricity; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 2001. Proceedings ICT 2001. XX International Conference on
Conference_Location
Beijing
ISSN
1094-2734
Print_ISBN
0-7803-7205-0
Type
conf
DOI
10.1109/ICT.2001.979936
Filename
979936
Link To Document