DocumentCode :
2176353
Title :
Extraction of material properties for low-K and low-loss dielectrics using cavity resonator and efficient finite difference solver up to 40GHz
Author :
Hwang, Seunghyun E. ; Swaminathan, Madhavan ; Venkatakrishnan, Venkatesan
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2008
fDate :
10-12 Dec. 2008
Firstpage :
53
Lastpage :
56
Abstract :
Liquid crystal polymer (LCP) has been used as an RF substrate material for the packaging. As the technology continues to improve, LCP does not satisfy all of the thickness requirements for mobile applications. Therefore, a new dielectric material (Material-A) has been developed, which can be extremely thin and has a lower processing temperature than LCP. To accurately extract Material-A properties, we present a new extraction method which has a major advantage over the previously published techniques especially for low dielectric and low loss dielectrics. In this paper, the new method has been applied for extracting the frequency-dependent dielectric constant and loss tangent up to 40 GHz for Material-A, and a Debye model that satisfies the causality has been developed.
Keywords :
cavity resonators; dielectric losses; finite element analysis; liquid crystal devices; liquid crystal polymers; low-k dielectric thin films; permittivity; permittivity measurement; Debye model; RF substrate material; cavity resonator; extraction method; finite difference solver; frequency-dependent dielectric constant; liquid crystal polymer; loss tangent; low-K dielectrics; low-loss dielectrics; material properties; packaging; Cavity resonators; Crystalline materials; Dielectric losses; Dielectric materials; Dielectric substrates; Finite difference methods; Liquid crystal polymers; Material properties; Packaging; Radio frequency;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-2633-1
Electronic_ISBN :
978-1-4244-2634-8
Type :
conf
DOI :
10.1109/EDAPS.2008.4735997
Filename :
4735997
Link To Document :
بازگشت