Title :
Quasi-static lumped element stand-alone package model for quad flat package
Author :
Paoletti, Umberto ; Hisakado, Takashi ; Wada, Osami
Author_Institution :
Dept. of Electr. Eng., Kyoto Univ., Kyoto, Japan
Abstract :
A new type of package model is introduced, which allows to take into account the effect of external structures, such as PCB traces and ground plane, by limiting at the same time the disclosure of internal details of the package. The model is verified with a scaled quad flat package (QFP) and two different printed circuit board (PCB) patterns, but the general procedure should be applicable to other types of package.
Keywords :
electronics packaging; printed circuits; external structures; printed circuit board patterns; quasistatic lumped element stand-alone package model; scaled quad flat package; Conductors; Current distribution; Electromagnetic fields; Electromagnetic modeling; Electronics packaging; Frequency; Integrated circuit modeling; Integrated circuit packaging; Magnetic fields; Printed circuits;
Conference_Titel :
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-2633-1
Electronic_ISBN :
978-1-4244-2634-8
DOI :
10.1109/EDAPS.2008.4735998
