• DocumentCode
    2176473
  • Title

    Physics of failure for portable electronic devices in military applications

  • Author

    Habtour, E. ; Werner, B. ; Hilburn, A. ; Saraidaridis, H.I.

  • Author_Institution
    US Army Res. Lab., Aberdeen Proving Ground, MD, USA
  • fYear
    2013
  • fDate
    28-31 Jan. 2013
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    In military applications electronic devices play a vital role in the success of a mission. These devices which provide control, guidance, communication, and reconnaissance are critical components in modern unmanned vehicular applications. The current trend is to provide a human interface to control theses systems via portable devices. This trend in modern warfare has increased the complexity of electronic equipment, especially in low volume, highly sophisticated, and dense electronic systems. These modern devices take advantage of the remarkable advances made in low cost commercial electronics. This current movement of using commercial-off-the-shelf (COTS) electronics and devices for military applications has led to concerns about their reliability in harsh battlefield environments. The increase in the use of COTS components lead to the need to improve the reliability of these components by understanding the failure mechanisms due to thermal loads, dynamic vibration, and shock through Physics of Failure (PoF) analyses.
  • Keywords
    electronic products; failure analysis; military equipment; reliability; COTS components; PoF analyses; commercial-off-the-shelf electronics; dynamic vibration; failure mechanisms; military applications; physics-of-failure analyses; portable electronic devices; reliability; shocks; thermal loads; Fatigue; Finite element analysis; Load modeling; Military standards; Reliability; Stress; Vibrations; Physics of Failure; drop; failure mechanism; handheld;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability and Maintainability Symposium (RAMS), 2013 Proceedings - Annual
  • Conference_Location
    Orlando, FL
  • ISSN
    0149-144X
  • Print_ISBN
    978-1-4673-4709-9
  • Type

    conf

  • DOI
    10.1109/RAMS.2013.6517620
  • Filename
    6517620