PCB embedded capacitor with central via connection structure for RF application

Although PCB embedded passives technology has been studied for several years, there are still many researches continuing to make it more complete and applicable. This work focus on the electrical performance of MIM (metal-insulator-metal) type embedded capacitor. For high frequency application, the self-resonance frequency (SRF) is an important design parameter. Different I/O connection types and positions on the electrode will change the parasitic effect and thus affect SRF. In this paper, an embedded capacitor with central via connection is utilized to enhance the SRF. Since the coupling effect from other nearby components also degrades the characteristic of embedded capacitor, a shielding structure for PCB embedded capacitor is designed to prevent the interference from internal high density routing and keep good electrical performance.