• DocumentCode
    2176557
  • Title

    A physical-location-aware X-filling method for IR-drop reduction in at-speed scan test

  • Author

    Hsieh, Wen-Wen ; Lin, I-Sheng ; Hwang, TingTing

  • Author_Institution
    Dept. of Comput. Sci., Nat. Tsing Hua Univ., Hsinchu
  • fYear
    2009
  • fDate
    20-24 April 2009
  • Firstpage
    1234
  • Lastpage
    1237
  • Abstract
    IR-drop problem during test mode exacerbates delay defects and results in false failures. In this paper, we take the X-filling approach to reduce IR-drop effect during at-speed test. The main difference between our approach and the previous X-filling methods lies in two aspects. The first one is that we take the spatial information into consideration in our approach. The second one is how X-filling is performed. We propose a backward-propagation approach instead of a forward-propagation approach taken in previous work. The experimental results show that we have 42.81% reduction for the worst IR-drop and 45.71% reduction in the average IR-drop as compared to random fill method.
  • Keywords
    automatic test pattern generation; integrated circuit testing; logic testing; IR drop reduction; at-speed scan test; backward propagation; physical location aware X filling method; spatial information; Chip scale packaging; Circuit testing; Computer science; Delay; Fabrication; Flip-flops; Switches; Switching circuits; Test pattern generators; Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation & Test in Europe Conference & Exhibition, 2009. DATE '09.
  • Conference_Location
    Nice
  • ISSN
    1530-1591
  • Print_ISBN
    978-1-4244-3781-8
  • Type

    conf

  • DOI
    10.1109/DATE.2009.5090852
  • Filename
    5090852