DocumentCode
2176679
Title
Optimization of via structure in multilayer PCB for high speed signal transmission
Author
Kang, Bong-Gyu ; Kim, Hyun ; Hee-Do Kang ; Yook, Jong-Gwan
Author_Institution
Dept. of Electr. & Electron. Eng., Yonsei Univ., South Korea
fYear
2008
fDate
10-12 Dec. 2008
Firstpage
105
Lastpage
108
Abstract
44-layers PCB (printed circuit board) for semiconductor test has been analyzed and optimized to improve the transmission performance. By dividing the PCB to subsections and analyzing each section, stub resonance reported in [1] brings the degeneration of transmission performance.
Keywords
printed circuit testing; printed circuits; 3D full EM simulation; blind via; circuit simulation; clearance pad; high speed signal transmission; multilayer PCB; printed circuit board; resonance frequency; via structure; Circuit simulation; Circuit testing; Costs; Frequency; Nonhomogeneous media; Performance analysis; Resonance; Semiconductor device testing; Signal analysis; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location
Seoul
Print_ISBN
978-1-4244-2633-1
Electronic_ISBN
978-1-4244-2634-8
Type
conf
DOI
10.1109/EDAPS.2008.4736010
Filename
4736010
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