Pad shape effects on high frequency signal transfer characteristics

Author

Nam, Ki-hoon ; Koh, Eun-kwang ; Hong, Eun-Ju ; Park, Seung-Hun ; Lee, Jai-Yeol ; Kwak, In-Gu ; Nah, Wansoo

Author_Institution

Sch. of Inf. & Commun. Eng., SungkyunKwan Univ., Suwon, South Korea

fYear

2008

fDate

10-12 Dec. 2008

Firstpage

117

Lastpage

119

Abstract

As one of the interconnects between board to board, pads on the boards could have considerable effects on high frequency signal transfer characteristics. In this paper, pad shape effects on the signal integrity is analyzed using add-in card model by simulation, and a test fixture designed and fabricated to test to a serial-ATA cable is used to measure the effect of pad length on high frequency signal transfer characteristics. From the simulation and measurement, it is confirmed that the pads make a considerable effects on the signal transfer characteristics, especially in high frequency range, and we need to carefully design the characteristic impedance of the pads.

Keywords

cables (electric); electric impedance; integrated circuit interconnections; signal processing; add-in card model; board to board interconnection; high frequency signal transfer; pad impedance; pad shape effects; serial-ATA cable; signal integrity; Connectors; Coplanar waveguides; Delta modulation; Frequency; Impedance; Planar waveguides; Shape; Signal analysis; Signal design; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of

Conference_Location

Seoul

Print_ISBN

978-1-4244-2633-1

Electronic_ISBN

978-1-4244-2634-8

Type

conf

DOI

10.1109/EDAPS.2008.4736013

Filename

4736013