• DocumentCode
    2176743
  • Title

    A circuit model for ESD performance analysis of printed circuit boards

  • Author

    Seol, Byong-Su ; Lee, Jong-Sung ; Lim, Jae-Deok ; Lee, Hyungseok ; Park, HarkByeong ; Nandy, Argha ; Pommerenke, David

  • Author_Institution
    Corp. Technol. Oper., Samsung Electron. Co. Ltd., Suwon, South Korea
  • fYear
    2008
  • fDate
    10-12 Dec. 2008
  • Firstpage
    120
  • Lastpage
    123
  • Abstract
    This paper provides a SPICE-compatible circuit model for characterizing electrostatic discharge (ESD) clamping performance of protection devices mounted on printed circuit boards (PCBs). An equivalent circuit model for a commercial ESD generator is introduced and a simulation methodology of an ESD protection device with non-linear resistance characteristic using voltage controlled current source is described. These models combined to create a full circuit model with a PCB model in a SPICE-like circuit simulator. Comparison results between the simulated and measured are presented to verify the accuracy of the proposed circuit model. A trade-off analysis between the ESD clamping performance and signal integrity with the ESD protection device in high-speed applications is also presented as a case study.
  • Keywords
    SPICE; electrostatic discharge; equivalent circuits; printed circuits; ESD protection device; SPICE-compatible circuit model; electrostatic discharge clamping; equivalent circuit model; nonlinear resistance characteristic; performance analysis; printed circuit boards; voltage controlled current source; Character generation; Circuit simulation; Clamps; Electrical resistance measurement; Electrostatic discharge; Equivalent circuits; Performance analysis; Printed circuits; Protection; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4244-2633-1
  • Electronic_ISBN
    978-1-4244-2634-8
  • Type

    conf

  • DOI
    10.1109/EDAPS.2008.4736014
  • Filename
    4736014