DocumentCode
2176743
Title
A circuit model for ESD performance analysis of printed circuit boards
Author
Seol, Byong-Su ; Lee, Jong-Sung ; Lim, Jae-Deok ; Lee, Hyungseok ; Park, HarkByeong ; Nandy, Argha ; Pommerenke, David
Author_Institution
Corp. Technol. Oper., Samsung Electron. Co. Ltd., Suwon, South Korea
fYear
2008
fDate
10-12 Dec. 2008
Firstpage
120
Lastpage
123
Abstract
This paper provides a SPICE-compatible circuit model for characterizing electrostatic discharge (ESD) clamping performance of protection devices mounted on printed circuit boards (PCBs). An equivalent circuit model for a commercial ESD generator is introduced and a simulation methodology of an ESD protection device with non-linear resistance characteristic using voltage controlled current source is described. These models combined to create a full circuit model with a PCB model in a SPICE-like circuit simulator. Comparison results between the simulated and measured are presented to verify the accuracy of the proposed circuit model. A trade-off analysis between the ESD clamping performance and signal integrity with the ESD protection device in high-speed applications is also presented as a case study.
Keywords
SPICE; electrostatic discharge; equivalent circuits; printed circuits; ESD protection device; SPICE-compatible circuit model; electrostatic discharge clamping; equivalent circuit model; nonlinear resistance characteristic; performance analysis; printed circuit boards; voltage controlled current source; Character generation; Circuit simulation; Clamps; Electrical resistance measurement; Electrostatic discharge; Equivalent circuits; Performance analysis; Printed circuits; Protection; Voltage control;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location
Seoul
Print_ISBN
978-1-4244-2633-1
Electronic_ISBN
978-1-4244-2634-8
Type
conf
DOI
10.1109/EDAPS.2008.4736014
Filename
4736014
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