Title :
Minimizing electromagnetic interference in power-ground cavities
Author :
Ndip, Ivan ; Ohnimus, Florian ; Guttowski, Stephan ; Reichl, Herbert
Author_Institution :
Fraunhofer Inst. for Reliability & Microintegration, IZM, Berlin, Germany
Abstract :
In this paper, electromagnetic interference (EMI) in power-ground cavities is quantified for conventional layer stack-ups used in low-cost electronic packaging. Traditional methods to minimize EMI and their limitations are discussed. Our novel approach to minimize EMI by minimizing/preventing the excitation of parallel-plate-modes in power ground cavities is then presented. Finally, the advantages of our approach in ensuring Electromagnetic Reliability (EMR) of microsystems are discussed.
Keywords :
electromagnetic interference; reliability; EMI; electromagnetic interference; electromagnetic reliability; microsystems; parallel-plate-modes; power-ground cavities; Coupling circuits; Electromagnetic coupling; Electromagnetic interference; Filters; Impedance; Metamaterials; Microstrip; Periodic structures; Resonance; Resonant frequency;
Conference_Titel :
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-2633-1
Electronic_ISBN :
978-1-4244-2634-8
DOI :
10.1109/EDAPS.2008.4736016
