Title :
Co-Optimization of signal, power, and thermal distribution networks for 3D ICs
Author :
Lee, Young-Joon ; Lim, Sung Kyu
Author_Institution :
Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solution to dramatically reduce the operating temperature of 3D ICs. In addition, designers use a highly complex hierarchical power distribution network in conjunction with decoupling capacitors to deliver currents. However, these thermal and power/ground interconnects together with those used for signal delivery compete with each other for routing resources including various types of Through-Silicon-Vias (TSVs). This paper presents the first work on routing with these multi-functional interconnects in 3D: signal, thermal, and power distribution networks. We demonstrate how to consider various physical, electrical, and thermo-mechanical requirements of these multi-functional interconnects to successfully complete routing while addressing various reliability concerns.
Keywords :
capacitors; circuit optimisation; distribution networks; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; microfluidics; thermal management (packaging); 3D stacked IC technology; IC reliability; complex hierarchical power network; decoupling capacitors; liquid cooling; microfluidic channel; multifunctional interconnects; operating temperature reduction; power network distribution; power/ground interconnects; routing resources; signal co-optimization; signal delivery; thermal distribution networks; through-silicon-vias; Heat sinks; Liquid cooling; Microchannel; Microfluidics; Power system interconnection; Power systems; Resistance heating; Routing; Thermal conductivity; Thermal resistance;
Conference_Titel :
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-2633-1
Electronic_ISBN :
978-1-4244-2634-8
DOI :
10.1109/EDAPS.2008.4736025
