Thermal-aware electrical analysis of high-speed interconnect

This paper studied the problem of coupled electrical and thermal modeling, specifically for the signal integrity analysis of on-chip interconnect due to the influence of substrate and interconnect temperature. The approach presented in this paper is using finite-difference method (FDM) to solve for the temperature profile of the substrate. The information of the substrate temperature is used for subsequent thermal modeling of the interconnect. The 1D thermal modeling of the interconnect is done by using an equivalent thermal circuit model, which is compatible with the SPICE simulator and can fast produce the temperature profile of the interconnect. Numerical examples are presented, which show that the temperature of the interconnect affects the electrical performance of the interconnect.