• DocumentCode
    2177140
  • Title

    LTCC-based triplexers for WiMAX front-end modules

  • Author

    Kim, Dongsu ; Kim, Dong Ho ; Park, Chong Dae ; Ryu, Jong In ; Kim, Jun Chul ; Kang, Nam Kee

  • Author_Institution
    Electron. Mater.&Packaging Res. Center, Korea Electron. Technol. Inst., Seongnam, South Korea
  • fYear
    2008
  • fDate
    10-12 Dec. 2008
  • Firstpage
    190
  • Lastpage
    193
  • Abstract
    In this paper, we present low temperature co-fired ceramic (LTCC)-based triplexers for both transmit (TX) and receive (RX) paths in worldwide interoperability for microwave access (WiMAX) tri-band front-end modules. The triplexer for TX path consists of 2- and 5-GHz lowpass filters, a 3-GHz bandpass filter, and a matching network. All components are fully embedded in an LTCC substrate, and it occupies about 5.0 mm × 3.0 mm with a substrate thickness of 0.5 mm. The triplexer for TX path provides relatively low insertion loss at three passbands with a second-harmonic rejection of more than 30 dB. The triplexer for RX path is composed of three embedded bandpass filters and a matching network. The triplexer for RX path also provides low insertion loss at three passbands and high attenuation at other passbands. The size of the triplexer for RX path is about 5.0 mm × 4.0 mm × 0.5 mm. The measured results of the triplexers are in good agreement with the simulated results.
  • Keywords
    WiMax; band-pass filters; ceramics; low-pass filters; multiplexing equipment; WiMAX; bandpass filter; insertion loss; low temperature cofired ceramic-based triplexers; lowpass filters; matching network; microwave access triband front-end modules; second-harmonic rejection; Band pass filters; Ceramics; Impedance matching; Insertion loss; Matched filters; Packaging; Passband; Power amplifiers; Temperature; WiMAX;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4244-2633-1
  • Electronic_ISBN
    978-1-4244-2634-8
  • Type

    conf

  • DOI
    10.1109/EDAPS.2008.4736032
  • Filename
    4736032