A feasibility study of antenna in a package technology for 40GHz front-end module

Author

Byun, Woo-Jin ; Kim, Bong-Su ; Kim, Kwang-Seon ; Kim, Jong-Myun ; Song, Myung-Sun

Author_Institution

Radio Technol. Dept., ETRI, South Korea

fYear

2008

fDate

10-12 Dec. 2008

Firstpage

198

Lastpage

201

Abstract

In this paper, a front-end module integrated with a planar dipole antenna based on LTCC technology is proposed and its feasibility is studied at 40 GHz band. Front-end module is a part of 40 GHz transceiver and consists of a single pole double throw (SPDT) switch, a laminated waveguide filter and a planar dipole antenna. The proposed structure shows good agreements between measured and simulated results. Size of the proposed structure is 27.5 Ã— 5.85 mm².

Keywords

band-pass filters; ceramic packaging; dipole antennas; laminates; millimetre wave antennas; millimetre wave filters; millimetre wave integrated circuits; modules; planar antennas; switches; transceivers; waveguide filters; LTCC technology; bandwidth 40 GHz; front-end module; laminated waveguide bandpass filter; package technology; planar dipole antenna; single pole double throw switch; transceiver; Band pass filters; Dipole antennas; Integrated circuit technology; Microstrip antennas; Millimeter wave technology; Packaging; Resonator filters; Switches; Transceivers; Waveguide components;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of

Conference_Location

Seoul

Print_ISBN

978-1-4244-2633-1

Electronic_ISBN

978-1-4244-2634-8

Type

conf

DOI

10.1109/EDAPS.2008.4736034

Filename

4736034