DocumentCode :
2177215
Title :
Coupled high-speed interconnect analysis on parallel platforms
Author :
Paul, D. ; Nakhla, N.M. ; Achar, R. ; Nakhla, M.S.
Author_Institution :
Dept. of Electron., Carleton Univ., Ottawa, ON, Canada
fYear :
2008
fDate :
10-12 Dec. 2008
Firstpage :
202
Lastpage :
205
Abstract :
Signal integrity analysis is becoming extremely important in validation of high-speed designs. In a system containing high-speed interconnects, the presence of a large number of coupled lines presents difficult challenges for performing fast simulations. In this paper, a novel parallel algorithm based on both physical and time-domain partitioning is proposed that allows for the efficient analysis of circuits containing large number of coupled lines. The proposed method exploits the recently developed method of combining transverse partitioning and waveform relaxation. Examples are provided to demonstrate the efficiency and scalability of the proposed algorithm.
Keywords :
electronic engineering computing; integrated circuit design; integrated circuit interconnections; parallel algorithms; time-domain analysis; circuit analysis; coupled high-speed interconnect analysis; high-speed design; integrated circuit technology; parallel algorithm; parallel platform; physical partitioning; signal integrity analysis; time-domain partitioning; transverse partitioning; waveform relaxation; Algorithm design and analysis; Circuit analysis; Circuit simulation; Coupling circuits; Integrated circuit interconnections; Parallel algorithms; Scalability; Signal analysis; Signal design; Time domain analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging and Systems Symposium, 2008. EDAPS 2008. Electrical Design of
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-2633-1
Electronic_ISBN :
978-1-4244-2634-8
Type :
conf
DOI :
10.1109/EDAPS.2008.4736035
Filename :
4736035
Link To Document :
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