• DocumentCode
    2178171
  • Title

    A physics-based heterojunction bipolar transistor model for integrated circuit simulation

  • Author

    Fellows, James A. ; Bright, Victor M. ; Jenkins, Thomas J.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
  • fYear
    1994
  • fDate
    23-27 May 1994
  • Firstpage
    334
  • Abstract
    A new physics-based dc model for a heterojunction bipolar transistor (HBT) has been developed. This model offers features not found in previous analytical or physics-based HBT models, such as consideration of a cylindrical emitter-base geometry and direct implementation into SPICE (Simulation Program with Integrated Circuit Emphasis). The model parameters are determined from a knowledge of the device material, geometry, and fabrication process. The HBT model is developed by using semiconductor physics to calculate modified parameters for the existing SPICE Bipolar junction transistor (BJT) model. Model generated data was obtained via a SPICE dc simulation for devices with different geometries and doping profiles. The resulting current-voltage characteristics were compared to the corresponding measured curves and excellent agreement was, obtained. The model predicted the device´s performance over its entire dc range of operation to within ±5%. Although a few of the model parameters were determined empirically, the physical nature of the model provides insight into new device designs by directly relating the material, geometry, and process specifications to the model parameters
  • Keywords
    SPICE; bipolar integrated circuits; heterojunction bipolar transistors; semiconductor device models; HBT model; SPICE; current-voltage characteristics; cylindrical emitter-base geometry; dc model; dc simulation; heterojunction bipolar transistor; heterojunction bipolar transistor model; integrated circuit simulation; DC generators; Fabrication; Geometry; Heterojunction bipolar transistors; Integrated circuit modeling; Physics; SPICE; Semiconductor materials; Semiconductor process modeling; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace and Electronics Conference, 1994. NAECON 1994., Proceedings of the IEEE 1994 National
  • Conference_Location
    Dayton, OH
  • Print_ISBN
    0-7803-1893-5
  • Type

    conf

  • DOI
    10.1109/NAECON.1994.332988
  • Filename
    332988