DocumentCode
2178171
Title
A physics-based heterojunction bipolar transistor model for integrated circuit simulation
Author
Fellows, James A. ; Bright, Victor M. ; Jenkins, Thomas J.
Author_Institution
Dept. of Electr. & Comput. Eng., Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
fYear
1994
fDate
23-27 May 1994
Firstpage
334
Abstract
A new physics-based dc model for a heterojunction bipolar transistor (HBT) has been developed. This model offers features not found in previous analytical or physics-based HBT models, such as consideration of a cylindrical emitter-base geometry and direct implementation into SPICE (Simulation Program with Integrated Circuit Emphasis). The model parameters are determined from a knowledge of the device material, geometry, and fabrication process. The HBT model is developed by using semiconductor physics to calculate modified parameters for the existing SPICE Bipolar junction transistor (BJT) model. Model generated data was obtained via a SPICE dc simulation for devices with different geometries and doping profiles. The resulting current-voltage characteristics were compared to the corresponding measured curves and excellent agreement was, obtained. The model predicted the device´s performance over its entire dc range of operation to within ±5%. Although a few of the model parameters were determined empirically, the physical nature of the model provides insight into new device designs by directly relating the material, geometry, and process specifications to the model parameters
Keywords
SPICE; bipolar integrated circuits; heterojunction bipolar transistors; semiconductor device models; HBT model; SPICE; current-voltage characteristics; cylindrical emitter-base geometry; dc model; dc simulation; heterojunction bipolar transistor; heterojunction bipolar transistor model; integrated circuit simulation; DC generators; Fabrication; Geometry; Heterojunction bipolar transistors; Integrated circuit modeling; Physics; SPICE; Semiconductor materials; Semiconductor process modeling; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Aerospace and Electronics Conference, 1994. NAECON 1994., Proceedings of the IEEE 1994 National
Conference_Location
Dayton, OH
Print_ISBN
0-7803-1893-5
Type
conf
DOI
10.1109/NAECON.1994.332988
Filename
332988
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