Title :
Millimeter-wave three-dimensional masterslice MMICS
Author :
Nishikawa, K. ; Kamogawa, K. ; Inoue, K. ; Onodera, K. ; Hirano, M. ; Tokumitsu, T. ; Toyoda, I.
Author_Institution :
NTT Wireless Syst. Labs., Kanagawa, Japan
Abstract :
The three-dimensional (3D) masterslice MMIC technology has, even in the millimeter-wave region, the advantages of high integration levels, simple design procedures, short turn-around-time, and low fabrication cost. Fabricated V-band amplifiers achieve an 8-dB gain and a 5.3 dB noise figure in an area of 0.27 mm/sup 2/. A U-band single-chip downconverter is also demonstrated.
Keywords :
MIMIC; application specific integrated circuits; integrated circuit design; millimetre wave amplifiers; millimetre wave frequency convertors; 5.3 dB; 8 dB; U-band; V-band; design procedures; fabrication cost; integration levels; millimetre-wave amplifiers; single-chip downconverter; three-dimensional masterslice MMICS; turn-around-time; Coupling circuits; Dielectric substrates; Gallium arsenide; MMICs; Microstrip; Millimeter wave circuits; Millimeter wave communication; Millimeter wave radar; Millimeter wave technology; Millimeter wave transistors;
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 1998 IEEE
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-4439-1
DOI :
10.1109/RFIC.1998.682089
