Title :
Thermal analysis for high-power LED down-light
Author :
Ma, Xiangjun ; Wu, Ligang ; Dai, Shixun ; Bai, Kun ; Zhou, Boyou ; Zheng, Zhaoyong
Author_Institution :
Coll. of Inf. Sci. & Eng., Ningbo Univ., Ningbo, China
Abstract :
Even though light-emitting diodes may have a very long life, poorly designed LED lamp can experience a short life. A simulation of temperature distribution of four chips high-power LED down-light was made by finite element method. Based on the consistency of the LED lamp experimental and simulation results, the analyses of the effect of thermal conductivities of PCB, thermal grease, heat sink, convection coefficients and the height of the heat sink on the junction temperature were made, which provide an effective reference for the thermal design.
Keywords :
LED lamps; convection; finite element analysis; heat sinks; temperature distribution; thermal analysis; thermal conductivity; LED lamp; PCB; convection coefficient; finite element method; heat sink; high-power LED down-light; light-emitting diodes; temperature distribution; thermal analysis; thermal conductivities; thermal design; thermal grease; Conductivity; Heat sinks; Junctions; LED lamps; Thermal analysis; Thermal conductivity; FEM; high-power LED down-light; thermal analysis;
Conference_Titel :
Electronics, Communications and Control (ICECC), 2011 International Conference on
Conference_Location :
Zhejiang
Print_ISBN :
978-1-4577-0320-1
DOI :
10.1109/ICECC.2011.6066674
