DocumentCode :
2179366
Title :
Design, Analysis, and Optimization of DDR2 Memory Power Delivery Network
Author :
Lee, Junho ; Kim, Hyunseok ; Kyung, Kimyung ; You, Minyoung ; Lee, Hyungdong ; Park, Kunwoo ; Chung, Byongtae
Author_Institution :
Hynix Semicond. Inc., Icheon
fYear :
2007
fDate :
29-31 Oct. 2007
Firstpage :
87
Lastpage :
90
Abstract :
In this paper, design procedure and analysis method of power delivery network of DDR2 memory chip are introduced. The power delivery network of memory chip is optimized by tuning the location of power/ground chip pad and on-chip decoupling capacitor´s W/L size. The results show that the properly designed power/ground chip pads and decoupling capacitors greatly reduce power noise, resulting in the reduction of chip cost by using less area for on-chip decoupling capacitor.
Keywords :
DRAM chips; integrated circuit design; low-power electronics; decoupling capacitors; memory chip; memory power delivery network; power noise; Capacitors; Design optimization; Impedance; Noise generators; Noise reduction; Packaging; Process design; Random access memory; Semiconductor device noise; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2007 IEEE
Conference_Location :
Atlanta, GA
Print_ISBN :
978-1-4244-0883-2
Type :
conf
DOI :
10.1109/EPEP.2007.4387131
Filename :
4387131
Link To Document :
بازگشت