DocumentCode
2179459
Title
Wafer Level Fabrication and Packaging of Miniature Combline Filters
Author
Mehta, Sarabjit ; Petre, Peter
Author_Institution
HRL Lab. LLC., Malibu
fYear
2007
fDate
29-31 Oct. 2007
Firstpage
103
Lastpage
106
Abstract
We will report on HRL Laboratories´ progress in developing state-of-the-art, extremely miniature, combline filters. These filters utilize standard semiconductor substrates, and are fabricated and packaged at the wafer-level -this ensures high reproducibility in device performance, and allows large scale production at a significant cost reduction. The salient filter features are: small size, low insertion loss, tunability, high EM isolation, high power handling capability, and high out of band rejection.
Keywords
comb filters; power filters; wafer level packaging; miniature combline filters; packaged filter; standard semiconductor substrates; wafer level fabrication; Costs; Fabrication; Filters; Laboratories; Large-scale systems; Production; Reproducibility of results; Semiconductor device packaging; Substrates; Wafer scale integration; Combline filters; miniature RF filter; packaged filter;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2007 IEEE
Conference_Location
Atlanta, GA
Print_ISBN
978-1-4244-0883-2
Type
conf
DOI
10.1109/EPEP.2007.4387135
Filename
4387135
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