• DocumentCode
    2179459
  • Title

    Wafer Level Fabrication and Packaging of Miniature Combline Filters

  • Author

    Mehta, Sarabjit ; Petre, Peter

  • Author_Institution
    HRL Lab. LLC., Malibu
  • fYear
    2007
  • fDate
    29-31 Oct. 2007
  • Firstpage
    103
  • Lastpage
    106
  • Abstract
    We will report on HRL Laboratories´ progress in developing state-of-the-art, extremely miniature, combline filters. These filters utilize standard semiconductor substrates, and are fabricated and packaged at the wafer-level -this ensures high reproducibility in device performance, and allows large scale production at a significant cost reduction. The salient filter features are: small size, low insertion loss, tunability, high EM isolation, high power handling capability, and high out of band rejection.
  • Keywords
    comb filters; power filters; wafer level packaging; miniature combline filters; packaged filter; standard semiconductor substrates; wafer level fabrication; Costs; Fabrication; Filters; Laboratories; Large-scale systems; Production; Reproducibility of results; Semiconductor device packaging; Substrates; Wafer scale integration; Combline filters; miniature RF filter; packaged filter;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2007 IEEE
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    978-1-4244-0883-2
  • Type

    conf

  • DOI
    10.1109/EPEP.2007.4387135
  • Filename
    4387135