• DocumentCode
    2179892
  • Title

    System Design for 3D Multi-FPGA Packaging

  • Author

    Thorolfsson, Thorlindur ; Franzon, Paul D.

  • Author_Institution
    North Carolina State Univ., Raleigh
  • fYear
    2007
  • fDate
    29-31 Oct. 2007
  • Firstpage
    171
  • Lastpage
    174
  • Abstract
    3D stacking and integration can provide tremendous advantages to electronic systems. This paper explores the system-level considerations such as layout, routing and IO in the design of 3D multi-FPGA packaging, along with their architectural implications.
  • Keywords
    field programmable gate arrays; integrated circuit layout; integrated circuit packaging; logic CAD; multichip modules; 3D integration; 3D multi-FPGA packaging; 3D stacking; system-level considerations; Active circuits; Copper; Electronics packaging; Field programmable gate arrays; Plugs; Routing; SDRAM; Sensor systems; Stacking; Thermal management; 3D IC; CAD; VLSI;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2007 IEEE
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    978-1-4244-0883-2
  • Type

    conf

  • DOI
    10.1109/EPEP.2007.4387152
  • Filename
    4387152
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2179892