Title :
System Design for 3D Multi-FPGA Packaging
Author :
Thorolfsson, Thorlindur ; Franzon, Paul D.
Author_Institution :
North Carolina State Univ., Raleigh
Abstract :
3D stacking and integration can provide tremendous advantages to electronic systems. This paper explores the system-level considerations such as layout, routing and IO in the design of 3D multi-FPGA packaging, along with their architectural implications.
Keywords :
field programmable gate arrays; integrated circuit layout; integrated circuit packaging; logic CAD; multichip modules; 3D integration; 3D multi-FPGA packaging; 3D stacking; system-level considerations; Active circuits; Copper; Electronics packaging; Field programmable gate arrays; Plugs; Routing; SDRAM; Sensor systems; Stacking; Thermal management; 3D IC; CAD; VLSI;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2007 IEEE
Conference_Location :
Atlanta, GA
Print_ISBN :
978-1-4244-0883-2
DOI :
10.1109/EPEP.2007.4387152
