Title :
Impact analysis of silicon and bondwires on an on-chip antenna
Author :
Gentner, Philipp K. ; Adalan, Ayse ; Scholtz, Arpad L. ; Mecklenbräuker, Christoph F.
Author_Institution :
Inst. of Telecommun., Vienna Univ. of Technol., Vienna, Austria
Abstract :
The efficiency of integrated on-chip antennas is low due to their small aperture and lossy environment. In this contribution, the influence of the silicon bulk substrate´s thickness and conductivity is evaluated as well as the influence of bondwires in close vicinity to an on-chip antenna. The impact on the antenna impedance and radiation pattern is analysed and discussed. Measurements of an on-chip antenna manufactured by utilising the top metal layer of a standard Complementary Metal-Oxide Semiconductor (CMOS) are compared to simulation results.
Keywords :
CMOS integrated circuits; antenna radiation patterns; silicon; CMOS; antenna impedance; bondwires; complementary metal-oxide semiconductor; conductivity; impact analysis; metal layer; on-chip antenna; radiation pattern; silicon bulk substrate thickness; Antenna measurements; Conductivity; Dipole antennas; Q factor; Silicon; Substrates; System-on-a-chip;
Conference_Titel :
Antennas and Propagation (EUCAP), 2012 6th European Conference on
Conference_Location :
Prague
Print_ISBN :
978-1-4577-0918-0
Electronic_ISBN :
978-1-4577-0919-7
DOI :
10.1109/EuCAP.2012.6206043
