DocumentCode :
2180080
Title :
Performance Impact of Simultaneous Switching Output Noise on Graphic Memory Systems
Author :
Kim, Joong-Ho ; Kim, Woopoung ; Oh, Dan ; Schmitt, Ralf ; Feng, June ; Yuan, Chuck ; Luo, Lei ; Wilson, John
Author_Institution :
Rambus Inc., Los Altos, CA
fYear :
2007
fDate :
29-31 Oct. 2007
Firstpage :
197
Lastpage :
200
Abstract :
Simultaneous switching output noise (SSO) in single-ended signaling systems is one of the major performance limiters as data rate scales higher. This paper studies the impact of SSO on high performance graphic memory systems (GDDR3/4) using a systematic approach considering both signal and power integrity simultaneously. Specifically, power distribution network (PDN) and channel models are co-simulated in order to study the impact of SSO noise on channel voltage and timing margin. The reference voltage (VREF) noise is also considered as SSO noise couples to both signal and VREF. A methodology for characterizing the system performance by separating high and medium frequency analysis is demonstrated. The worst case system performance is simulated by varying data patterns to excite either medium (100-300 MHz) or high (GHz) frequency noise. A data bus inversion (DBI) coding has recently introduced in GDDR4 to remedy SSO noise and its effectiveness is also investigated in this paper. Finally, the system performance is compared between 4-layer flip-chip and 2-layer chip-scaled packages.
Keywords :
DRAM chips; chip scale packaging; circuit noise; flip-chip devices; DBI coding; GDDR3/4 systems; channel models; chip-scaled packages; data bus inversion coding; flip-chip packages; frequency 100 MHz to 300 MHz; frequency analysis; graphic memory systems; power distribution network; power integrity; reference voltage noise; signal integrity; simultaneous switching output noise; single-ended signaling systems; Chip scale packaging; Communication system signaling; Frequency; Graphics; Performance analysis; Power system modeling; Power systems; System performance; Timing; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2007 IEEE
Conference_Location :
Atlanta, GA
Print_ISBN :
978-1-4244-0883-2
Type :
conf
DOI :
10.1109/EPEP.2007.4387159
Filename :
4387159
Link To Document :
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