Title :
Selection Criteria and Tradeoffs for 0402 and 0204 Ceramic Chip Capacitors for On-Package Decoupling Applications
Author_Institution :
Texas Instrum., Austin
Abstract :
A comprehensive sweep of detailed time-domain simulations using 3D PEEC models of the package and PCB are used to map out the design space and to set performance expectations for 0402 and 0204 ceramic chip capacitors for use as on-package decoupling capacitors.
Keywords :
ceramic capacitors; ceramic packaging; 3D PEEC models; ceramic chip capacitors; on package decoupling applications; time domain simulations; Capacitance; Capacitors; Ceramics; Frequency; Noise reduction; Packaging; Paramagnetic resonance; Power system modeling; Resistors; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2007 IEEE
Conference_Location :
Atlanta, GA
Print_ISBN :
978-1-4244-0883-2
DOI :
10.1109/EPEP.2007.4387160
