DocumentCode
2180105
Title
Selection Criteria and Tradeoffs for 0402 and 0204 Ceramic Chip Capacitors for On-Package Decoupling Applications
Author
Young, Brian
Author_Institution
Texas Instrum., Austin
fYear
2007
fDate
29-31 Oct. 2007
Firstpage
201
Lastpage
204
Abstract
A comprehensive sweep of detailed time-domain simulations using 3D PEEC models of the package and PCB are used to map out the design space and to set performance expectations for 0402 and 0204 ceramic chip capacitors for use as on-package decoupling capacitors.
Keywords
ceramic capacitors; ceramic packaging; 3D PEEC models; ceramic chip capacitors; on package decoupling applications; time domain simulations; Capacitance; Capacitors; Ceramics; Frequency; Noise reduction; Packaging; Paramagnetic resonance; Power system modeling; Resistors; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2007 IEEE
Conference_Location
Atlanta, GA
Print_ISBN
978-1-4244-0883-2
Type
conf
DOI
10.1109/EPEP.2007.4387160
Filename
4387160
Link To Document