Title :
Dual-Mode High-Speed Data Transmission Using Substrate Integrated Waveguide Interconnects
Author :
Suntives, Asanee ; Abhari, Ramesh
Author_Institution :
Dept. of Electr. & Comput. Eng., McGill Univ., Montreal, QC
Abstract :
The enclosed volume by a substrate integrated waveguide interconnect is re-utilized to increase the channel capacity. A stripline is embedded inside the waveguide, thus a dual-mode or hybrid interconnect structure is created. Isolation and transmission characteristics of the two signal channels are evaluated by fullwave simulations. Measurements of the fabricated prototype demonstrate that the hybrid platform handles an aggregate data rate of 8.5 Gb/s.
Keywords :
channel capacity; data communication; integrated circuit interconnections; strip lines; channel capacity; dual mode data transmission; dual-mode interconnect structure; embedded waveguide stripline; fullwave simulations; high speed data transmission; hybrid interconnect structure; substrate integrated waveguide interconnects; Data communication; Electromagnetic interference; Electromagnetic waveguides; Geometry; Integrated circuit interconnections; Microstrip; Planar waveguides; Prototypes; Radio frequency; Stripline;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2007 IEEE
Conference_Location :
Atlanta, GA
Print_ISBN :
978-1-4244-0883-2
DOI :
10.1109/EPEP.2007.4387164
