• DocumentCode
    2180329
  • Title

    Early supplier integration and management in ultrasound device development

  • Author

    Chandrappa, N. ; Grotjahn, P. ; Kawathekar, D.

  • Author_Institution
    Philips Ultrasound, India
  • fYear
    2013
  • fDate
    28-31 Jan. 2013
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    The system reliability was computed at several stages during project execution using the statistical and predictive information from system design, individual supplier´s predictions, system reliability demonstration test results, prior Field reliability data for like assemblies, and tests conducted at the supplier´s locations. One of the Field Reliability metric followed and tracked by Philips is MTBSE which means Mean Time Between Service Events. It is the ration of number of system days to the number of service events. The results at each stage were used to suitably update the predicted system reliability and determine required actions for the subsequent stages in order to achieve the end goal of an MTBSE equal or greater than 2.5 times that of the current products.
  • Keywords
    assembling; reliability; statistical analysis; supply chain management; ultrasonic devices; MTBSE; Philips; assembly; field reliability data; field reliability metric; mean time between service events; predictive information; project execution; statistical information; supplier integration and management; supplier locations; supplier predictions; system design; system reliability demonstration; ultrasound device development; Assembly; Reliability engineering; Resource management; Software; Software reliability; Ultrasonic imaging; Derating; Design Qualification Tests; Design for Reliability; Early Supplier Integration and Management; FMEA; MTBF; Mean Time Between Service Events; Reliability Allocation; Reliability Prediction; TAAF;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability and Maintainability Symposium (RAMS), 2013 Proceedings - Annual
  • Conference_Location
    Orlando, FL
  • ISSN
    0149-144X
  • Print_ISBN
    978-1-4673-4709-9
  • Type

    conf

  • DOI
    10.1109/RAMS.2013.6517759
  • Filename
    6517759