Title :
Efficient Signal and Power Integrity Analysis Using Parallel Techniques
Author :
Su, Tao ; Wang, Xiaofeng ; Bai, Zhengang ; Vennam, Venkata
Author_Institution :
Sigrity, Inc., Santa Clara
Abstract :
This paper describes the application of parallel algorithms for analyzing the electronic packages and PCB´s in a fast and efficient manner. The effectiveness of multithreading at various stages of the analysis has been illustrated. The application of distributed computation to further accelerate the solution process is demonstrated.
Keywords :
electronics packaging; printed circuits; distributed computation; electronic packages; parallel algorithms; parallel techniques; power integrity analysis; printed circuit board; signal integrity analysis; Algorithm design and analysis; Computational modeling; Distributed computing; Electronics packaging; Libraries; Multithreading; Packaging machines; Parallel algorithms; Signal analysis; Yarn; Distributed computation; Multi-threading; Power integrity; Signal integrity;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2007 IEEE
Conference_Location :
Atlanta, GA
Print_ISBN :
978-1-4244-0883-2
DOI :
10.1109/EPEP.2007.4387172
