DocumentCode
2180442
Title
Efficient Signal and Power Integrity Analysis Using Parallel Techniques
Author
Su, Tao ; Wang, Xiaofeng ; Bai, Zhengang ; Vennam, Venkata
Author_Institution
Sigrity, Inc., Santa Clara
fYear
2007
fDate
29-31 Oct. 2007
Firstpage
245
Lastpage
248
Abstract
This paper describes the application of parallel algorithms for analyzing the electronic packages and PCB´s in a fast and efficient manner. The effectiveness of multithreading at various stages of the analysis has been illustrated. The application of distributed computation to further accelerate the solution process is demonstrated.
Keywords
electronics packaging; printed circuits; distributed computation; electronic packages; parallel algorithms; parallel techniques; power integrity analysis; printed circuit board; signal integrity analysis; Algorithm design and analysis; Computational modeling; Distributed computing; Electronics packaging; Libraries; Multithreading; Packaging machines; Parallel algorithms; Signal analysis; Yarn; Distributed computation; Multi-threading; Power integrity; Signal integrity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2007 IEEE
Conference_Location
Atlanta, GA
Print_ISBN
978-1-4244-0883-2
Type
conf
DOI
10.1109/EPEP.2007.4387172
Filename
4387172
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